Chinese scientists have developed a groundbreaking semiconductor chip that’s thinner than one nanometer. The chip doesn’t use silicon, instead utilizing 2D materials like molybdenum disulphide and tungsten diselenide. It reportedly performs 40% faster than advanced 3nm silicon chips while using 10% less energy. The technology doesn’t require restricted EUV lithography equipment, potentially helping China overcome foreign technology sanctions. This breakthrough could reshape the global semiconductor landscape in coming years.
Dozens of Chinese scientists have revealed a groundbreaking semiconductor chip that’s thinner than a single nanometer. The ultra-thin chip uses 2D materials like molybdenum disulphide and tungsten diselenide instead of silicon, marking a major shift in how processors are made. This innovation comes as China seeks to reduce its reliance on foreign technology amid international sanctions.
The new chip operates 40% faster than advanced 3nm silicon chips made by industry leaders like Intel and TSMC. It also uses 10% less energy, addressing key concerns about power efficiency in modern computing. The design features bismuth-based transistors that avoid the miniaturization problems found in traditional silicon chips.
What makes this development especially notable is that it doesn’t require extreme ultraviolet (EUV) lithography, an expensive manufacturing process that has been difficult for China to access. The chip’s materials are only one atom thick, allowing for exceptional scalability that wasn’t possible with silicon. This represents a significant technological advancement in semiconductor fabrication techniques.
In performance tests, the Chinese chip outperformed leading transistors from Intel, Samsung, and TSMC. Its improved thermal performance and energy efficiency make it promising for applications in artificial intelligence, quantum computing, and telecommunications. The technology utilizes parallel processing capabilities similar to specialized AI accelerators, enabling it to handle complex calculations more efficiently.
The chip is built on RISC-V architecture, which gives developers more flexibility than proprietary designs. This approach allows China to develop advanced technology without relying on restricted foreign intellectual property. The researchers have described this silicon-free transistor as the fastest and most efficient ever created.
Currently, production remains at pilot scale, and consumer applications are likely several years away. Companies like Huawei might be among the first to implement this technology commercially.
While challenges remain regarding mass production and costs, this breakthrough represents a potential shift in global semiconductor leadership. The technology offers China a path to technological self-sufficiency in an industry that’s become increasingly politicized.
If successful at scale, these ultra-thin chips could reshape the international semiconductor market and supply chains in coming years.
